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d a t a sh eet product speci?cation file under integrated circuits, ic02 may 1992 integrated circuits saa7157 clock signal generator circuit for digital tv systems (scgc)
may 1992 2 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 features clock generation suitable for digital tv systems (line-locked) pll frequency multiplier to generate 4 times of input frequency dividers to generate clocks ll1.5a, ll1.5b, ll3a and ll3b (4th and 2nd multiples of input frequency) pll mode or vco mode selectable reset control and power fail detection suitable for applications with feature box and picture memory general description the saa7157 generates all clock signals required for a digital tv system suitable for the saa715x family and the saa7199b (denc). the circuit operates in either the phase-locked loop mode (pll) or voltage controlled oscillator mode (vco). quick reference data ordering information note 1. sot146-1; 1996 december 17. 2. sot163-1; 1996 december 17. symbol parameter min. typ. max. unit v dda analog supply voltage (pin 5) 4.5 5.0 5.5 v v ddd digital supply voltage (pins 8, 17) 4.5 5.0 5.5 v i dda analog supply current 3 - 9 ma i ddd digital supply current 10 - 60 ma v lfco lfco input voltage (peak-to-peak value) 1 - v dda v f i input frequency range 6.0 - 7.25 mhz v i input voltage low input voltage high 0 2.0 - - 0.8 v ddd v v v o output voltage low output voltage high 0 2.6 - - 0.6 v ddd v v t amb operating ambient temperature range 0 - 70 c extended type number package pins pin position material code saa7157 20 dil plastic sot146 (1) saa7157t 20 mini-pack (so20) plastic sot163a (2)
may 1992 3 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 fig.1 block diagram. functional description the saa7157 generates all clock signals required for a digital tv system suitable for the saa715x family consisting of an 8-bit analog-to-digital converter (adc8), digital video multistandard decoder (dmsd2) and video enhancement and d/a processor circuit (veda). optional extras (feature box, video memory etc.) can be driven via external buffers, advantageous for a digital tv system based on display standard conversion concepts. the 6.75 mhz input signal lfco (triangular waveform) coming from the dmsd or lfco2 is multiplied to 27 mhz by the pll (including phase detector, loop filter, vco and frequency divider) and output on ll1.5a (pin 7) and ll1.5b (pin 10). the 13.5 mhz frequencies are generated by dividers using ratio of 1:2 and are output on ll3a (pin 14) and ll3b (pin 20). the rectangular output signals have 50% duty factor. outputs with equal frequency may be connected together externally. the clock outputs go high during power-on reset (and chip enable) to ensure that no output clock signals are available before the pll has locked-on. mode select ms the lfco input signal is directly connected to the vco at ms = high. the circuit operates as an oscillator and frequency divider. this function is not tested. source select lfcosel line frequency control signal (lfco) is selected by lfcosel input. lfcosel = low: signal from lfco (pin 11) is selected. lfcosel = high: signal from lfco2 (pin 19) is selected. this function is not tested. chip enable ce the buffer outputs are enabled and resn is set to high by ce = high (fig.4). ce = low sets the clock outputs high and resn output low. handbook, full pagewidth meh452 loop filter phase detector power-on reset pre-filter and pulse shaper frequency divider 1 : 2 frequency divider 1 : 2 vco delay ms = low 7 10 14 20 15 12 resn cref ll3b ll3a ll1.5b (ll27b) ll1.5a (ll27a) 3 16 4 6, 9, 13, 18 pord lfcosel v ssa v ssd ms lfco lfco2 ce 2 19 11 1 5 8 17 v dda v ddd1 v ddd2 saa7157
may 1992 4 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 cref output tv2 digital clock reference output signal. clock qualifier signal to tv system with 2 times of lfco or lfco2 frequency. power-on reset power-on reset is activated at power-on, when the supply voltage decreases below 3.5 v (fig.4) or when chip enable is done. the indicator output resn is low for a time determined by capacitor on pin 3. the resn signal can be applied to reset other circuits of this digital tv system. the lfco or lfco2 input signals have to be applied before resn becomes high. pinning note 1. ms and lfco2 functions are not tested. lfco2 is a multiple of horizontal frequency. symbol pin description ms 1 mode select input (low = pll mode) ce 2 chip enable /reset (high = outputs enabled) pord 3 power-on reset delay, dependent on external capacitor v ssa 4 analog ground (0 v) v dda 5 analog supply voltage ( + 5 v) v ssd1 6 digital ground 1 (0 v) ll1.5a 7 line-locked clock output signal 1.5a (4 times f lfco ) v ddd1 8 digital supply voltage 1 ( + 5 v) v ssd2 9 digital ground 2 (0 v) ll1.5b 10 line-locked clock output signal 1.5b (4 times f lfco ) lfco 11 line-locked frequency control input signal 1 resn 12 reset output (active-low, fig.4) v ssd3 13 digital ground 3 (0 v) ll3a 14 line-locked clock output signal 3a (2 times f lfco ) cref 15 clock reference output, quali?er signal (2 times f lfco ) lfcosel 16 lfco source select (low = lfco selected) (1) v ddd2 17 digital supply voltage 2 ( + 5 v) v ssd4 18 digital ground 4 (0 v) lfco2 19 line-locked frequency control input signal 2 (1) ll3b 20 line-locked clock output signal 3b (2 times f lfco )
may 1992 5 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 pin configuration limiting values in accordance with the absolute maximum rating system (iec 134); ground pins as well as supply pins together connected. notes 1. inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is recommended to take normal handling precautions appropriate to handling mos devices . symbol parameter min. max. unit v dda analog supply voltage (pin 5) - 0.5 7.0 v v ddd digital supply voltage (pins 8 and 17) - 0.5 7.0 v v diff gnd difference voltage v dda - v ddd - 100 mv v o output voltage (i om = 20 ma) - 0.5 v ddd v p tot total power dissipation (dil20) 0 1.1 w t stg storage temperature range - 65 150 c t amb operating ambient temperature range 0 70 c v esd electrostatic handling (1) for all pins - tbf v fig.2 pin configuration.
may 1992 6 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 characteristics v dda = 4.5 to 5.5 v; v ddd = 4.5 to 5.5 v; f lfco = 6.0 to 7.25 mhz and t amb = 0 to 70 c unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit v dda analog supply voltage (pin 5) 4.5 5.0 5.5 v v ddd digital supply voltage (pins 8 and 17) 4.5 5.0 5.5 v i dda analog supply current (pin 5) 3 - 9ma i ddd digital supply current (i 8 + i 17 ) note 1 10 - 60 ma v reset power-on reset threshold voltage fig.4 - 3.5 - v input lfco (pin 11) v 11 dc input voltage 0 - v dda v v i input signal (peak-to-peak value) 1 - v dda v f lfco input frequency range 6.0 - 7.25 mhz c 11 input capacitance -- 10 pf inputs ms, ce, lfcosel and lfco2 (pins 1, 2, 16 and 19); note 3 v il input voltage low 0 - 0.8 v v ih input voltage high 2.0 - v ddd v f lfco2 input frequency range for lfco2 6.0 - 7.25 mhz i li input leakage current lfcosel 50 - 150 m a others -- 10 m a c i input capacitance -- 5pf output resn (pin 12) v ol output voltage low i o l = 2 ma 0 - 0.4 v v oh output voltage high i oh = - 0.5 ma 2.4 - v ddd v t d resn delay time c 3 = 0.1 m f; fig.4 20 - 200 ms output cref (pin 15) v ol output voltage low i o l = 2 ma 0 - 0.6 v v oh output voltage high i oh = - 0.5 ma 2.4 - v ddd v f cref output frequency cref fig.3 - 2 f lfco(2) mhz c l output load capacitance 15 - 40 pf t su set-up time fig.3; note 1 12 -- ns t hd hold time fig.3; note 1 4 -- ns
may 1992 7 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 notes 1. f lfco = 7.0 mhz and output load 40 pf (fig.3). v ssa and v ssd short connected together. 2. t comp is the rise time from low of all clocks to high of all clocks (fig.3) including rise time, skew and jitter components. measurements taken between 0.6 v and 2.6 v. skew between two llx clocks will not deviate more than 2 ns if output loads are matched within 20%. 3. ms and lfco2 functions not tested. output signals ll1.5a, ll1.5b, ll3a and ll3b (pins 7, 10, 14, and 20); note 3 v ol output voltage low i o l = 2 ma 0 - 0.6 v v oh output voltage high i oh = - 0.5 ma 2.6 - v ddd v t comp composite rise time fig.3; notes 1 and 2 - - 8 ns f ll output frequency ll1.5a fig.3 - 4 f lfco(2) mhz output frequency ll1.5b - 4 f lfco(2) mhz output frequency ll3a - 2 f lfco(2) mhz output frequency ll3b - 2 f lfco(2) mhz t r , t f rise and fall times note 1; fig.3 - - 5 ns t ll duty factor ll1.5a, ll1.5b, ll3a and ll3b (mean values) note 1; fig.3; at 1.5 v level 43 50 57 % symbol parameter conditions min. typ. max. unit fig.3 output timing. handbook, full pagewidth meh456 t hd t hd t su t ll1.5h t ll1.5l t ll1.5 2.4 v 0.6 v 2.6 v 1.5 v 0.6 v 2.6 v 1.5 v 0.6 v t r t r t f t comp t f t ll3l t ll3h t ll3 ll3a ll3b ll1.5a ll1.5b cref
may 1992 8 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 fig.4 reset procedure. handbook, full pagewidth meh457 oscillation oscillation disturbed t d t d normal operation normal operation power failure starts a new reset procedure reset time clock high during internal reset pll lock-on 0 v + 3.5 v power-on v dda v ddd lfco resn ll1.5a ll1.5b ll3a ll3b fig.5 internal circuit. handbook, full pagewidth 1 2 16 19 ms ce lfcosel lfco2 11 lfco v ddd v ssd 7 10 14 15 20 ll1.5a ll1.5b ll3a ll3b cref 12 resn meh468 v ddd v ssd v ddd v ssd
may 1992 9 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 package outline unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot146-1 92-11-17 95-05-24 a min. a max. b z max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.0 4.2 0.51 3.2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.078 0.17 0.020 0.13 sc603 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 20 1 11 10 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) (1) dip20: plastic dual in-line package; 20 leads (300 mil) sot146-1
may 1992 10 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013ac pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 95-01-24 97-05-22
may 1992 11 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so r eflow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
may 1992 12 philips semiconductors product speci?cation clock signal generator circuit for digital tv systems (scgc) saa7157 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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